PMIC-Perceptive Electronic Components

PMIC

Picture

Model

Description

Quantity

Unite Price

VND10N06-1-E
Brand: STMicroelectronics

Package Case: TO-251-3 Short Leads, IPak, TO-251AA
RoHs Status: ROHS3 Compliant

Stock: 8384

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TLE6232GPAUMA2
Brand: Infineon Technologies

Package Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 5974

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MAX613CPD
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 14-DIP (0.300", 7.62mm)
RoHs Status: RoHS non-compliant

Stock: 9329

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TPS22985YFPR
Brand: Texas Instruments

Package Case: 16-XFBGA, DSBGA
RoHs Status: ROHS3 Compliant

Stock: 3816

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TPS2012D
Brand: Texas Instruments

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 3086

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TPS2221PWP
Brand: Texas Instruments

Package Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 6810

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NX18P3001UKZ
Brand: NXP USA Inc.

Package Case: 12-UFBGA, WLCSP
RoHs Status: ROHS3 Compliant

Stock: 8136

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TPS2546QRTERQ1
Brand: Texas Instruments

Package Case: 16-WFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 2941

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TPIC9201PWP
Brand: Texas Instruments

Package Case: 20-PowerTSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 5110

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MC25XS6300EK
Brand: NXP USA Inc.

Package Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 6748

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TPS2014P
Brand: Texas Instruments

Package Case: 8-DIP (0.300", 7.62mm)
RoHs Status: ROHS3 Compliant

Stock: 8416

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BTS61101SJAXUMA1
Brand: Infineon Technologies

Package Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 4196

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MC10XS6325EK
Brand: NXP USA Inc.

Package Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 2804

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MIC2564A-1YTS
Brand: Microchip Technology

Package Case: 24-TSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 8166

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TPIC9201PWPR
Brand: Texas Instruments

Package Case: 20-PowerTSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 7701

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MC10XS6225EK
Brand: NXP USA Inc.

Package Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 1319

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MC17XSG500EK
Brand: NXP USA Inc.

Package Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 7215

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TCK106G,LF
Brand: Toshiba Semiconductor and Storage

Package Case: 4-UFBGA
RoHs Status: RoHS Compliant

Stock: 5171

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TLE7234SEXUMA1
Brand: Infineon Technologies

Package Case: 20-SOIC (0.295", 7.50mm Width)
RoHs Status: ROHS3 Compliant

Stock: 2004

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MAX4824ETP+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 20-WFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 5614

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IPS031S
Brand: Infineon Technologies

Package Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
RoHs Status:

Stock: 5571

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IPS021S
Brand: Infineon Technologies

Package Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
RoHs Status:

Stock: 7243

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AUIPS1011STRL
Brand: Infineon Technologies

Package Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
RoHs Status:

Stock: 3220

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AUIPS1011R
Brand: Infineon Technologies

Package Case: TO-252-3, DPak (2 Leads + Tab), SC-63
RoHs Status:

Stock: 2651

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AUIPS1021STRL
Brand: Infineon Technologies

Package Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
RoHs Status:

Stock: 8348

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