Memory IC-Perceptive Electronic Components

Memory IC

Picture

Model

Description

Quantity

Unite Price

7130LA25PFGI
Brand: Renesas Electronics America Inc

Package Case: 64-LQFP
RoHs Status: ROHS3 Compliant

Stock: 1005

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AT24C01C-MAHM-T
Brand: Microchip Technology

Package Case: 8-UFDFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 8532

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CY7C1061G30-10ZSXI
Brand: Cypress Semiconductor Corp

Package Case: 54-TSOP (0.400&quot;, 10.16mm Width)
RoHs Status: ROHS3 Compliant

Stock: 5426

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M24C04-FMN6TP
Brand: STMicroelectronics

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 8454

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DS1225AD-150IND+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 28-DIP Module (0.600", 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 6068

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FM22LD16-55-BG
Brand: Cypress Semiconductor Corp

Package Case: 48-TFBGA
RoHs Status: ROHS3 Compliant

Stock: 6241

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M24C08-RMN6TP
Brand: STMicroelectronics

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 8778

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CAT24C32YI-GT3
Brand: onsemi

Package Case: 8-TSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 1194

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MTFC32GAZAQHD-WT
Brand: Micron Technology

Package Case: 153-VFBGA
RoHs Status: ROHS3 Compliant

Stock: 1536

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CAT25040VI-GT3
Brand: onsemi

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 2732

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M48Z58Y-70PC1
Brand: STMicroelectronics

Package Case: 28-DIP Module (0.600&quot;, 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 4396

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DS1230Y-70+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 28-DIP Module (0.600", 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 7439

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DS1245Y-70+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 32-DIP Module (0.600", 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 6329

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M24C02-FMH6TG
Brand: STMicroelectronics

Package Case: 5-UFDFN
RoHs Status:

Stock: 1868

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M24C16-DFCU6TP/K
Brand: STMicroelectronics

Package Case: 4-XFBGA, WLCSP
RoHs Status: ROHS3 Compliant

Stock: 5932

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MT40A1G16RC-062E IT:B
Brand: Micron Technology

Package Case: 96-TFBGA
RoHs Status: ROHS3 Compliant

Stock: 7900

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MT53E384M32D2DS-053 WT:E
Brand: Micron Technology

Package Case: 200-WFBGA
RoHs Status: ROHS3 Compliant

Stock: 7872

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DS1270Y-70#
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 36-DIP Module (0.610", 15.49mm)
RoHs Status: ROHS3 Compliant

Stock: 2728

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DS1245Y-100+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 32-DIP Module (0.600", 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 4254

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DS1220AD-100IND+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 24-DIP Module (0.600", 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 5203

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CY14B101LA-SP25XIT
Brand: Cypress Semiconductor Corp

Package Case: 48-BSSOP (0.295", 7.50mm Width)
RoHs Status: ROHS3 Compliant

Stock: 3230

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DS1245Y-120+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 32-DIP Module (0.600", 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 8875

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MT29F256G08AUCABH3-10ITZ:A
Brand: Micron Technology

Package Case: 100-LBGA
RoHs Status: ROHS3 Compliant

Stock: 5257

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MT25QL01GBBB8E12-0AUT
Brand: Micron Technology

Package Case: 24-TBGA
RoHs Status: ROHS3 Compliant

Stock: 7444

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DS1230AB-100+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 28-DIP Module (0.600", 15.24mm)
RoHs Status: ROHS3 Compliant

Stock: 1304

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