Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. As the Memory IC Company of excellence, Winbond strives to provide customer-driven memory solutions backed by the expert capabilities of product design, technology R&D, manufacturing, and sales services.
Winbond provides its partners with high-quality foundry services; meanwhile, manufactures Specialty DRAM, Mobile Memory and Flash Memory which are marketed under its own corporate brand name. With the optimizations of cost structure and capacity allocation, Winbond keeps pace with the latest technologies through good collaborations with international partners, ceaselessly achieves the long-term profitability and stable growth for the corporation. Professionalism and innovation are the main goals that Winbond continues pursuing.
At the same time, Winbond provides comprehensive training courses, a continuously improving employee-benefit system, and employment opportunities based on performance. Winbond received the Friendly Workplace Award from the Executive Yuan’s Council of Labor Affairs in Taiwan.

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Winbond is product portfolio consists of NOR Flash, SLC NAND Flash, mobile SRAM, dedicated DRAM.