STATS ChipPAC is a dynamic company manufacturing facilities throughout Asia. STATS is an integrated service provider in providing the innovative test and assembly solutions that transformcustomers’ devices into marketable and commercially successful products. All the employees of STATS have technical or engineering skills. STATS manufacturing facilities are located in South Korea, Singapore, China, Malaysia, Thailand and Taiwan STATS’s services including Packaging services, Test services, Pre-production and post-production services. STATS offer package design; electrical, mechanical and thermal simulation; measurement and design of leadframes and laminate substrates. It also offer test-related services such as burn-in process support, reliability testing, thermal and electrical characterization, dry pack and tape and reel. What’s more, package development, test software and related hardware development, warehousing and drop shipment services are include. Nowadays, STATS has a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. And STATS has been successful in attracting new customers withpackaging and test capabilities and then expandingrelationship with such customers to provide full turnkey solutions tailored to their individual needs.